Hot embossing holographic images in BOPP shrink films through large-area roll-to-roll nanoimprint lithographyMENGLIN JIANG; SHIWEI LIN; WENKAI JIANG et al.Applied surface science. 2014, Vol 311, pp 101-106, issn 0169-4332, 6 p.Article

A self-pumping and self-breathing micro direct methanol fuel cell with polymer bipolar platesLINGJUN SUN; CHONG LIU; JUNSHENG LIANG et al.Journal of power sources (Print). 2011, Vol 196, Num 18, pp 7533-7540, issn 0378-7753, 8 p.Article

Surface plasmon resonance in near-field coupled gold cylinder arrays fabricated by EUV-interference lithography and hot embossingSAHOO, P. K; VOGELSANG, K; SCHIFT, H et al.Applied surface science. 2009, Vol 256, Num 2, pp 431-434, issn 0169-4332, 4 p.Conference Paper

Multichannel arrays on polymer substrates: Towards a disposable proteomics chipBECKER, H; EHRFELD, W; POMMERSHEIM, R et al.SPIE proceedings series. 1999, pp 728-733, isbn 0-8194-3154-0, 2VolConference Paper

Fabrication of photonic crystals for infrared applicationsLAI, Yeong-Lin; CHIU, Chi-Cheng.Colloids and surfaces. A, Physicochemical and engineering aspects. 2008, Vol 313-314, pp 497-499, issn 0927-7757, 3 p.Conference Paper

Hot embossing of diffractive optically variable images in biaxially-oriented polypropyleneLEECH, Patrick W; LEE, Robert A.Microelectronic engineering. 2007, Vol 84, Num 1, pp 25-30, issn 0167-9317, 6 p.Article

Fabrication of 50 nm patterned nickel stamp with hot embossing and electroforming processHONG, Sung-Hoon; LEE, Jong-Hwa; LEE, Heon et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 977-979, issn 0167-9317, 3 p.Conference Paper

Instrumented indentation testing for local characterisation of polymer properties after nanoimprintCROSS, G. L. W; O'CONNELL, B. S; PETHICA, J. B et al.Microelectronic engineering. 2005, Vol 78-79, pp 618-624, issn 0167-9317, 7 p.Conference Paper

Production of movable metallic microstructures by aligned hot embossing and Reactive Ion EtchingROETTING, O; KÖHLER, B; REUTHER, F et al.SPIE proceedings series. 1999, pp 1038-1045, isbn 0-8194-3154-0, 2VolConference Paper

Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampersPENGCHENG XIE; PENG HE; YEN, Ying-Chieh et al.Surface & coatings technology. 2014, Vol 258, pp 174-180, issn 0257-8972, 7 p.Article

Prototyping of microfluidic systems using a commercial thermoplastic elastomerROY, Emmanuel; GEISSLER, Matthias; GALAS, Jean-Christophe et al.Microfluidics and nanofluidics (Print). 2011, Vol 11, Num 3, pp 235-244, issn 1613-4982, 10 p.Article

Simple and cost-effective fabrication of two-dimensional plastic nanochannels from silica nanowire templatesLEI ZHANG; FUXING GU; LIMIN TONG et al.Microfluidics and nanofluidics (Print). 2008, Vol 5, Num 6, pp 727-732, issn 1613-4982, 6 p.Article

Analysis of the nanoimprint lithography with a viscous modelYOUNG, Wen-Bin.Microelectronic engineering. 2005, Vol 77, Num 3-4, pp 405-411, issn 0167-9317, 7 p.Article

Hot embossed polyethylene through-hole chips for bead-based microfluidic devicesJIE CHOU; NAN DU; OU, Tina et al.Biosensors & bioelectronics. 2013, Vol 42, pp 653-660, issn 0956-5663, 8 p.Article

Fabrication of plastic microlens array using gas-assisted micro-hot-embossing with a silicon moldCHANG, C.-Y; YANG, S.-Y; HUANG, L.-S et al.Infrared physics & technology. 2006, Vol 48, Num 2, pp 163-173, issn 1350-4495, 11 p.Article

3D-Hot embossing of undercut structures: an approach to micro-zippersBOGDANSKI, N; SCHULZ, H; WISSEN, M et al.Microelectronic engineering. 2004, Vol 73-74, pp 190-195, issn 0167-9317, 6 p.Conference Paper

Hot embossing of PTFE: Towards superhydrophobic surfacesJUCIUS, D; GRIGALIUNAS, V; MIKOLAJUNAS, M et al.Applied surface science. 2011, Vol 257, Num 6, pp 2353-2360, issn 0169-4332, 8 p.Article

Fabrication of Artificial Petal Sculptures by Replication of Sub-micron Surface WrinklesSCHWEIKART, Alexandra; ZIMIN, Denys; HANDGE, Ulrich A et al.Macromolecular chemistry and physics (Print). 2010, Vol 211, Num 2, pp 259-264, issn 1022-1352, 6 p.Article

UV nanoimprint using flexible polymer template and substrateHONG, Sung-Hoon; HWANG, Jae-Yeon; LEE, Heon et al.Microelectronic engineering. 2009, Vol 86, Num 3, pp 295-298, issn 0167-9317, 4 p.Article

Investigation of the separation of 3D-structures with undercutsMÖLLENBECK, S; BOGDANSKI, N; WISSEN, M et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 1007-1010, issn 0167-9317, 4 p.Conference Paper

Pattern replication of 100 nm to millimeter-scale features by thermal nanoimprint lithographyBO CUI; VERES, Teodor.Microelectronic engineering. 2006, Vol 83, Num 4-9, pp 902-905, issn 0167-9317, 4 p.Conference Paper

PEN as substrate for new solar cell technologiesFONRODONA, M; ESCARRE, J; VILLAR, F et al.Solar energy materials and solar cells. 2005, Vol 89, Num 1, pp 37-47, issn 0927-0248, 11 p.Article

Choice of the molecular weight of an imprint polymer for hot embossing lithographySCHULZ, H; WISSEN, M; BOGDANSKI, N et al.Microelectronic engineering. 2005, Vol 78-79, pp 625-632, issn 0167-9317, 8 p.Conference Paper

Surface texturing of polytetrafluoroethylene by hot embossingJUCIUS, D; GUOBIENE, A; GRIGALIUNAS, V et al.Applied surface science. 2010, Vol 256, Num 7, pp 2164-2169, issn 0169-4332, 6 p.Article

Development of ultrasonic micro hot embossing technologyMEKARU, Harutaka; GOTO, Hiroshi; TAKAHASHI, Masaharu et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 1282-1287, issn 0167-9317, 6 p.Conference Paper